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eBook Three-Dimensional Integrated Circuit Layout (Distinguished Dissertations in Computer Science) ePub

eBook Three-Dimensional Integrated Circuit Layout (Distinguished Dissertations in Computer Science) ePub

by A. C. Harter

  • ISBN: 0521416302
  • Category: Engineering
  • Subcategory: Engineering
  • Author: A. C. Harter
  • Language: English
  • Publisher: Cambridge University Press; 1 edition (November 29, 1991)
  • Pages: 240
  • ePub book: 1525 kb
  • Fb2 book: 1762 kb
  • Other: txt rtf lrf lit
  • Rating: 4.9
  • Votes: 398

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Three-Dimensional Integrated Circuit Layout (Distinguished Dissertations in Computer Science).

Three-Dimensional Integrated Circuit Layout (Distinguished Dissertations in Computer Science). Download (pdf, . 6 Mb) Donate Read. Epub FB2 mobi txt RTF. Converted file can differ from the original. If possible, download the file in its original format.

Three-Dimensional Integrated Circuit Layout. Winner of the Distinguished Dissertation in Computer Science award, this work will prove invaluable to both designers and hardware engineers involved in the development of practical three-dimensional integrated circuits. Published online: 05 May 2010. Project Factorisations in Partial Evaluation.

Three-Dimensional Integrated Circuit Layout Harter Cambridge Academ 9780521118163 : First published .

Three-Dimensional Integrated Circuit Layout Harter Cambridge Academ 9780521118163 : First published in 1991, this thesis concentrates upon the design of three-dimensional, rather than the trad. Дополнительное описание

Three-Dimensional Integrated Circuit Layout book.

Three-Dimensional Integrated Circuit Layout book.

A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu.

A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration.

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. The theory and design of integrated circuits has moved forward in leaps and bounds in recent years. This book concentrates on the design of three-dimensional, rather than traditional two-dimensional, circuits. The theory behind such circuits, together with experimental results, are presented in detail.

This book describes the use of qualified types to provide a general framework for the combination of polymorphism and overloading. Series: Distinguished Dissertations in Computer Science (Book 9). Paperback: 172 pages. Publisher: Cambridge University Press (October 16, 2003).

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The theory and design of integrated circuits has moved forward in leaps and bounds in recent years. This book concentrates on the design of three-dimensional, rather than traditional two-dimensional, circuits. The theory behind such circuits, together with experimental results, are presented in detail.