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eBook Development and Packaging of Microsystems Using Foundry Services ePub

eBook Development and Packaging of Microsystems Using Foundry Services ePub

by Jeffrey T. Butler

  • ISBN: 1423560612
  • Subcategory: No category
  • Author: Jeffrey T. Butler
  • Language: English
  • Publisher: Storming Media (1998)
  • ePub book: 1638 kb
  • Fb2 book: 1847 kb
  • Other: mbr doc lrf azw
  • Rating: 4.7
  • Votes: 392

Description

Several advances to the MEMS and microsystem state of the art were achieved through the design and characterization of novel MEMS devices and packaging, which are compatible with CMOS microelectronics.

Development and packaging of microsystems using foundry services /. January 1998. The development of the IC package is a dynamic technology. Applications that were unattainable only a decade ago are now commonplace thanks to advances in package design. Thesis (Ph. -Air Force Institute of Technology, 1998. Moreover, the increasing demand for smaller, faster and cheaper products is forcing the packaging technology to keep pace with the progress in semiconductor technology.

Abstract Methods of packaging al systems (MEMS) using two advanced multichip module (MCM) foundry processes are . Development and Packaging of Microsystems Using Foundry Services.

Abstract Methods of packaging al systems (MEMS) using two advanced multichip module (MCM) foundry processes are described. Special-purpose surface and bulk micromachined MEM. More).

Development and Packaging of Microsystems Using Foundry Services. Jeffrey Terrell Butler, American electrical engineer, educator. Achievements include membership on team that developed algorithm for low-power signal processing; development of methodology for packaging microelectro mechanical systems in commercial multichip module foundries. Major United States Air Force, 1988-1998. Member Institute of Electrical and Electronics Engineers, Tau Beta Pi, Eta Kappa Nu. Background. Butler, Jeffrey Terrell was born on February 14, 1966 in Fort Campbell, Kentucky, United States. Son of John Henry and Jo Ann (Mumford) Butler.

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Adapting Multichip Module Foundries for MEMS Packaging Jeffrey T. Butler, Victor M. Bright1, Patrick B. Chu2, and . Chu2, and Richard J. Saia3 Air Force Institute of Technology Dept. The use of MCM foundries enables the cost-effective development of microsystems in situations for which monolithic integration of MEMS and microelectronics is not suitable.

Packaging of MEMS using foundry multichip modules (MCMs) was shown to be a feasible approach to physical integration of MEMS with microelectronics.

Several advances to the MEMS state of the art were achieved through design and characterization of novel devices. Empirical and theoretical model of polysilicon thermal actuators were developed to understand their behavior. Packaging of MEMS using foundry multichip modules (MCMs) was shown to be a feasible approach to physical integration of MEMS with microelectronics. MEMS test die were packaged using Micro Module Systems MCM-D and General Electric High Density Intercounect and Chip-on-Flex MCM foundries.

Jeffrey T. Borenstein is Laboratory Technical Staff at the Charles Stark Draper Laboratory in Cambridge, Massachusetts, USA. Dr. Borenstein is a Technical Director for several of Draper’s programs in artificial organs, tissue engineering and implantable devices. His expertise is in MEMS fabrication technology, biological microsystems and the development of microdevices for therapeutic clinical applications

Butler JT (1998) Development and packaging of microsystems using foundry services. Cowan WD (1998) Foundry microfabrication of deformable mirrors for adaptive optics, Dissertation, Air Force Institute of Technology, Wright-Patterson AFB OhioGoogle Scholar

Butler JT (1998) Development and packaging of microsystems using foundry services. Dissertation, Air Force Institute of Technology, Wright-Patterson AFB OhioGoogle Scholar. Cowan WD (1998) Foundry microfabrication of deformable mirrors for adaptive optics, Dissertation, Air Force Institute of Technology, Wright-Patterson AFB OhioGoogle Scholar. 36. De Wolf I, Maes HE (1998) Mechanical stress measurements using micro-Raman spectroscopy.

Packaging is the science, art and technology of enclosing or protecting products for distribution, storage, sale, and use. Packaging also refers to the process of designing, evaluating, and producing packages. Packaging can be described as a coordinated system of preparing goods for transport, warehousing, logistics, sale, and end use. Packaging contains, protects, preserves, transports, informs, and sells.

This is a AIR FORCE INST OF TECH WRIGHT-PATTERSONAFB OH SCHOOL OF ENGINEERING report procured by the Pentagon and made available for public release. It has been reproduced in the best form available to the Pentagon. It is not spiral-bound, but rather assembled with Velobinding in a soft, white linen cover. The Storming Media report number is A136743. The abstract provided by the Pentagon follows: Micro-electro-mechanical systems (MEMS) are a new and rapidly growing field of research. Several advances to the MEMS state of the art were achieved through design and characterization of novel devices. Empirical and theoretical model of polysilicon thermal actuators were developed to understand their behavior. The most extensive investigation of the Multi-User MEMS Processes (MUMPs) polysilicon resistivity was also performed. The first published value for the thermal coefficient of resistivity (TCR) of the MUMPs Poly 1 layer was determined as 1.25 x 10(exp -3)/K. The sheet resistance of the MUMPs polysilicon layers was found to be dependent on linewidth due to presence or absence of lateral phosphorus diffusion. The functional integration of MEMS with CMOS was demonstrated through the design of automated positioning and assembly systems, and a new power averaging scheme was devised. Packaging of MEMS using foundry multichip modules (MCMs) was shown to be a feasible approach to physical integration of MEMS with microelectronics. MEMS test die were packaged using Micro Module Systems MCM-D and General Electric High Density Intercounect and Chip-on-Flex MCM foundries. Xenon difluoride (XeF2) was found to be an excellent post-packaging etchant for bulk micromachined MEMS. For surface micromachining, hydrofluoric acid (HF) can be used.